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ADVANCED MICRO DEVICES INC

AMD · FY2025

ALIGNED

CEO Package

$55.2M

Pay Ratio

—

Lisa T. Su

Returns outran pay growth by +39.8 pts

Broadcom Inc.

AVGO · FY2025

MISALIGNED

CEO Package

$205.3M

Pay Ratio

—

Hock E. Tan

Pay rose +7692% while TSR fell -58.4 pts

NVIDIA CORP

NVDA · FY2025

MISALIGNED

CEO Package

$49.9M

Pay Ratio

—

Jen-Hsun Huang

Pay rose +45.9% while TSR fell -132 pts

CEO Total Compensation — All Companies

AMD$55.2MAVGO$205.3MNVDA$49.9M

All values are grant-date fair value as reported in proxy statements.

Key Differences

The fastest way to read this comparison before dropping into the tables.

AVGO carries the largest package at $205.3M, about 4.1x NVDA.
AVGO reads misaligned, while AMD looks aligned.

Pay Component Breakdown

Latest CEO package mix by company. This stays on the CEO package even if the chart above is showing Top 5 pay.

AMD

Lisa T. Su

$55.2M

base salary2%
stock awards76%
option awards16%
non-equity incentive compensation6%
other compensation0%

AVGO

Hock E. Tan

$205.3M

base salary1%
stock awards99%
other compensation1%

NVDA

Jen-Hsun Huang

$49.9M

base salary3%
stock awards78%
non-equity incentive compensation12%
other compensation7%

Quick Comparison

CompanyCEOLatest YearTotal Comp
ADVANCED MICRO DEVICES INC(AMD)Lisa T. Su2025$55.2M
Broadcom Inc.(AVGO)Hock E. Tan2025$205.3M
NVIDIA CORP(NVDA)Jen-Hsun Huang2025$49.9M

Note: All compensation values shown are grant-date fair value as reported in proxy statements. Direct comparisons should account for differences in company size, industry, and compensation structure.

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