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Broadcom Inc.

AVGO · FY2025

MISALIGNED

CEO Package

$205.3M

Pay Ratio

Hock E. Tan

Pay rose +7692% while TSR fell -58.4 pts

NVIDIA CORP

NVDA · FY2025

MISALIGNED

CEO Package

$49.9M

Pay Ratio

Jen-Hsun Huang

Pay rose +45.9% while TSR fell -132 pts

MICRON TECHNOLOGY INC

MU

MIXED

CEO Package

Pay Ratio

MICRON TECHNOLOGY INC

Awaiting a fuller pay-performance history

CEO Total Compensation — All Companies

AVGO$205.3MNVDA$49.9MMU

All values are grant-date fair value as reported in proxy statements.

Key Differences

The fastest way to read this comparison before dropping into the tables.

AVGO carries the largest package at $205.3M, about 4.1x NVDA.
AVGO reads misaligned, while MU looks mixed.

Pay Component Breakdown

Latest CEO package mix by company. This stays on the CEO package even if the chart above is showing Top 5 pay.

AVGO

Hock E. Tan

$205.3M

base salary1%
stock awards99%
other compensation1%

NVDA

Jen-Hsun Huang

$49.9M

base salary3%
stock awards78%
non-equity incentive compensation12%
other compensation7%

MU

MICRON TECHNOLOGY INC

Component-level breakdown is unavailable for this company.

Quick Comparison

CompanyCEOLatest YearTotal Comp
Broadcom Inc.(AVGO)Hock E. Tan2025$205.3M
NVIDIA CORP(NVDA)Jen-Hsun Huang2025$49.9M
MICRON TECHNOLOGY INC(MU)N/A2025N/A

Note: All compensation values shown are grant-date fair value as reported in proxy statements. Direct comparisons should account for differences in company size, industry, and compensation structure.

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